Samsung microSD card
Samsung Electronics is introducing its branded memory cards for sale in Taiwan, with sales...
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KLA-Tencor 8900 inspection system
KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing...
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Asustek TUF Sabertooth 55i motherboard
Asustek Computer has unveiled the first motherboard under its new TUF series (The Ultimate...
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Hynix 54nm 1Gb DDR3
Hynix Semiconductor has announced its second-generation 1Gb DDR3 chip using 54nm process...
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Philips digital silicon photomultiplier
Royal Philips Electronics has announced development of a digital silicon photomultiplier...
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OCZ Z-Drive m84 SSD
OCZ Technology has announced the Z-Drive m84, a PCI-Express solid state drive (SSD). With...
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Applied HCT Diamond Squarer for solar wafers
Applied Materials has introduced ts new HCT Diamond Squarer system, which can reduce the...
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A-Data SH93 HDD
A-Data Technology has unveiled what it claims is the industry's first waterproof and shock...
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Multitest automatic contactor cleaning feature
Multitest Elektronische Systeme, a manufacturer of test equipment for semiconductor, has...
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Applied Topmet 4450 system
Applied Materials' new Topmet 4450 system deposits ultra-thin aluminum films on 4.5m wide...
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Samsung mobile display driver IC
Samsung Electronics has announced that it has developed a single chip that integrates a capacitive...
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OCZ Black Edition DDR3 modules
OCZ Technology has expanded its DDR3 module lineup to include certified OCZ Black Edition...
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Asustek RS300-E6 series servers
Asustek Computer has launched its new RS300-E6 series servers featuring Intel 3420 PCH chipset...
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IDF San Francisco: Intel CEO displayed a silicon wafer built on 22nm process
Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first...
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Applied Materials multiple printing technology for solar cells
Applied Materials has announced its Baccini Esatto technology, a multi-step screen printing...
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