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Wednesday 13 September 2023
ASUS AICS and National Taiwan University Hospital build smart healthcare ecosystem with privacy protections
ChatGPT, the latest artificial intelligence (AI) trend, has continued to create surprises in our daily lives. The trend has naturally spread to the field of medicine which generates a wave of new smart healthcare applications that combine biomedicine with AI. The development has driven massive growth in biomedical technology which drastically reduces the analysis and interpretation time, thereby increasing the accuracy and efficiency of diagnosis. The AI-oriented medicine is creating new opportunities as smart technology has become an indispensable force that drives the development of biomedical science.
Tuesday 12 September 2023
Watasumi turns sugar from waste water into power for primary food producers in Asia
Okinawa-based startup Watasumi is utilizing its biological technological expertise to convert organic carbon from waste water into energy through bioelectrochemical systems (BES). The company now targets small- and medium-sized food and drink industries around Japan, hoping to treat waste water more sustainably by leasing to clients the fully self-sustained compact module reactor that can also serve as an additional power source.
Tuesday 12 September 2023
Thermalytica sees potential of high-end insulation materials for corporate ESG and consumer products
Thermalytica, a spin-off startup from Japan's National Institute of Materials Science (NIMS), has developed an ultra-low density and lightweight silica-based thermal insulation material. The material, TIISA, is revolutionary in its structure; its volume can expand up to ten times larger than traditional aerogel when compared at the same weight.
Monday 11 September 2023
Blumind targets sustainability in the chip industry, seeking long-term partnership with Taiwan
Blumind is pitching a farsighted approach of neural network processing using an all-analog architecture for AI applications to be more sustainable in the future. The company has completed the latest phase of R&D and is now looking to commercialize its high-performance, low-cost, and sustainable AI chips.
Friday 8 September 2023
DigiKey launches City Digital Season 3 video series
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has released the full Season 3 of its "City Digital" video series, which explores the evolution and future of IoT in the automotive industry.
Friday 8 September 2023
Musk said that the most profitable mining platform in the past three years is here
As more players enter the cryptocurrency space, mining becomes more complex and requires more computing power. As a result, many people who used to mine cryptocurrencies using their own hardware are now finding it unsustainable due to high electricity bills and hardware wear and tear. Therefore, cloud mining has become an attractive option.
Thursday 7 September 2023
Innovative technology and exclusive service mechanisms - Manz Taiwan helps customers adopt FOPLP
Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has matured and its scope of application has gradually expanded beyond vehicle-mounted applications. It has become a critical packaging process for next-generation RFIC used for low earth orbit satellites. Robert Lin, General Manager of Manz Taiwan, stated that the FOPLP market demand will quickly expand as the number of success stories increases. Manz Taiwan has worked on these solutions for years. It has developed several innovative technologies and established comprehensive service mechanisms and professional teams to facilitate joint development with IDM OSAT (outsourced semiconductor assembly and test), Display panel, and IC substrate manufacturers to reduce the minimum requirements for production and commence mass production.
Wednesday 6 September 2023
GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps

Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC's 5nm process technology. The platform was demonstrated at the Partner Pavilion of the TSMC 2023 North America Technology Symposium. It contains a fully functional HBM3 Controller and PHY IP and vendor's HBM3 memory using TSMC's industry leading CoWoS® technology.

Wednesday 6 September 2023
AI's business opportunities drive computing demand
The semiconductor manufacturing industry, which constantly pursues ultimate performance, small form factors, and minimal power consumption, has been continuously refining various technologies in recent years. Apart from the two major trends of advanced processes and compound semiconductors, advanced packaging technology for heterogeneous integration has also become a recent market focal point in conjunction with the AI popularity. However, all three of the aforementioned technologies must be accompanied by material analysis (MA) and failure analysis (FA) to ensure product quality and reliability. With ample professional experience in semiconductor analysis, Integrated Service Technology Inc. (iST) provides a variety of solutions that cater to the diverse needs of customers in this field.
Wednesday 6 September 2023
iCometrue debuts at Semicom Taiwan 2023 with logic drive
In the midst of semiconductor, automation equipment, and material companies at SEMICON TAIWAN, iCometrue stands out with its unique business model.
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Summary of Tech Supply Chain News!
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