With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.
Prior to 2008, 200mm wafers were used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm wafers,...
Installed 200mm fab capacity has increased since 2009. By 2020, capacity is expected to reach 5.5 million wafers per month (wpm), although this is still less than the 2007 peak, according...
Enormous financial and technology hurdles continue to plague the development of 450mm wafers, and ambitious goals to put 450mm wafers to use have been scaled back. IC manufacturers...
Globalfoundries has announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the...
In 2008, 300mm wafers took over as the industry's primary wafer size in terms of total surface area used. The number of 300mm wafer fabrication facilities in operation continues to...
Nanoelectronics research center imec has announced the opening of a new 300mm cleanroom. With this 4,000-square meter new facility, imec's semiconductor research cleanrooms now totals...
As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed...
Front-end fab equipment spending (including new, used, and in-house) is projected to increase 5% in 2015 to US$37 billion, and rise another 6.6% in 2016 to US$39.4 billion, according...
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity in order to produce devices more cost-effectively on larger wafers...
IC Insights has published a ranking of the industry's largest IC manufacturers in terms of installed 300mm wafer start capacity in 2014. Included in the list are four companies from...
South Korea- and Taiwan-based chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers. Most of the IC industry's...
Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...
Nearly all new fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs, according to IC Insights.
