Spansion and China-based 300mm semiconductor foundry XMC have announced an agreement for XMC to license Spansion's floating gate NOR flash technology. The agreement expands the companies'...
In terms of surface area shipped, 300mm wafers represented 56% of worldwide installed capacity in December 2012. Production using 300mm wafers is forecast to increase steadily and...
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies. IC industry capacity is also...
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...
SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...
Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
