United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...
Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...
Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's...
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Intel is scheduled to kick off operation at its 300mm fab in Dalian, China, in 2010, according to the company. The chip giant also said it is looking to integrate its assembly and...
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
