Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies. IC industry capacity is also...
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...
SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...
Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
