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NEWS TAGGED ANTENNA
Monday 8 June 2020
TaiSol positive about 2H20 shipments of 5G base station, handset cooling solutions
TaiSol Electronics has seen strong shipment pull-ins from Chinese 5G infrastructure and smartphone clients starting June, with its production lines all running at full capacity to...
Tuesday 2 June 2020
Passive component makers see demand rise on China car sales pickup
As China's car market has started picking up gradually since the second half of April, demand for auto-use passive components, diodes and MOSFET devices is expected to grow significantly...
Thursday 28 May 2020
Kinsus gearing up to expand presence in FCBGA, AiP fields
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Tuesday 26 May 2020
IC analysis labs see slowdown in 2H20 demand from Huawei, US chipmakers
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
Monday 25 May 2020
ASE poised to apply SESUB-based SiP tech to new TWS devices
Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...
Friday 8 May 2020
CCL maker Ventec posts profit surge in 1Q20
Taiwan-based niche-type CCL maker Ventec International has reported its net profit surged 53.2% from a year earlier to NT$107 million (US$3.58 million) in the first quarter of 2020...
Tuesday 5 May 2020
PCB maker Dynamic eyes strong 2H20
PCB maker Dynamic Electronics expects demand to follow seasonal patterns in the second half of 2020, with stable ramp-up in shipments of high-end boards for automotive, server and...
Wednesday 29 April 2020
Flexium sees rising shipments for non-handset applications
Flexbile PCB maker Flexium Interconnect expects its shipments of MPI (modified polyimide) high-frequency antenna modules to non-handset segments to ramp up as a new growth driver...
Wednesday 29 April 2020
TSMC lands additional InFO packaging orders from Nephos
TSMC has landed additional InFO (integrated fan-out) packaging orders requiring short lead times from MediaTek's Nephos, according to industry sources.
Monday 27 April 2020
China PCB maker DSBJ sees double-digit profit fall in 2019
Dongshan Precision Manufacturing (DSBJ) saw its net earnings for 2019 drop 13.37% on year to CNY703 million (US$99.38 million) despite revenues surging 18.8% to CNY23.553 billion,...
Monday 27 April 2020
FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment and automotive...
Friday 24 April 2020
VCM component makers may see slowdown in shipments for iPhones in 2Q20
Shipments of voice coil motors (VCMs) used in camera modules for Apple's upcoming 5G iPhones are likely to see a slowdown around the middle or the latter half of the second quarter,...
Friday 24 April 2020
Taiflex building new plant in China to produce high-frequency FCCL
Flexible copper-clad laminate (FCCL) supplier Taiflex Scientific is building a new plant in Nantong, China's Jiangsu province, to produce high-frequency, high-speed FCCL materials...
Wednesday 22 April 2020
LCP antenna shipments to stay weak for mmWave 5G phones in 2020
As mmWave 5G phone market will see limited development momentum in 2020, shipments of flexible LCP (liquid crystal polymer) antenna boards for mmWave 5G smartphones are expected to...
Thursday 16 April 2020
AiP substrate shipments for mmWave 5G handsets may not take off in 2020
It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research