CONNECT WITH US
NEWS TAGGED ANTENNA
Friday 20 December 2019
Semiconductor tech to be more important in future 5G and AI applications
While 5G and AI will dominate new emerging tech applications to create cash flows for enterprises in the next decade, relevant semiconductor materials and technologies will not only...
Friday 13 December 2019
IC substrate suppliers see clear order visibility stretch into 2020
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Thursday 12 December 2019
Foxconn subsidiaries push into 5G businesses
Now that Young Liu has taken the helm, the Foxconn Technology Group (Hon Hai Precision Industry) has begun a series of transformations targeting the business opportunity from 5G,...
Wednesday 11 December 2019
Zhen Ding to build capacity for SiP, AiP substrates
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Wednesday 11 December 2019
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Tuesday 10 December 2019
Flexible PCB makers gearing up for 5G iPhone antenna orders
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Friday 6 December 2019
LTCC to be mainstream packaging material for mmWave modules
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...
Wednesday 4 December 2019
MPI, LCP materials for smartphone antennas to coexist
Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the...
Tuesday 3 December 2019
Market of RF components for telecom infrastructure to be shaken by active antenna systems, says Yole
The radio frequency (RF) front-end (FE) market for telecom infrastructure, estimated at US$1.47 billion in 2018, is forecast to reach US$2.52 billion in 2025, according to Yole Dev...
Monday 2 December 2019
Chipmakers, partners moving to secure 5G key components inventory
Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated...
Friday 29 November 2019
Cooling module makers eyeing robust application demand for 5G devices
The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...
Tuesday 26 November 2019
SiP, AiP processes to gain momentum for 5G applications in 2020
System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...
Friday 22 November 2019
Taiwan firms ready for production of LCP-based flexible antenna boards
Major Taiwan-based flexible PCB specialists have had their respective production lines for LCP (liquid crystal polymer) antenna boards ready for commercial runs as they are eyeing...
Monday 18 November 2019
PCB production lines may remain humming during Lunar New Year
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...
Friday 15 November 2019
ShunSin to ramp up capex in 2020 for SiP capacity expansion
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...