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Thursday 31 December 2020
Development of 3nm process challenging TSMC, Samsung
TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
Tuesday 17 November 2020
Components demand for iPhone 12 Pro series gaining momentum
Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
Wednesday 4 November 2020
TSMC sees 28nm process capacity utilization ramp up
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
Monday 26 October 2020
TSMC may move 6th-gen CoWoS to production in 2023
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
Friday 25 September 2020
TSMC to ramp up 3nm chip production starting 2H22
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
Thursday 24 September 2020
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
Wednesday 9 September 2020
OSAT providers to enjoy impressive SiP sales growth in 2020
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Friday 4 September 2020
SiP demand to boom in 2021
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
Tuesday 1 September 2020
USI obtains new SiP orders for Wi-Fi 6E modules
Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
Friday 21 August 2020
Nan Ya delivers sample SiP substrates for 5nm chips
Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...
Wednesday 19 August 2020
HiSilicon team in Taiwan shrinking
Huawei's chipmaking subsidiary HiSilicon has seen many of its staff in Taiwan leaving amid increasingly tough trade sanctions from the US on the Chinese tech group, according to industry...
Wednesday 22 July 2020
Kioxia SSD gain compatibility approval with Broadcom tri-mode adapters
Kioxia has announced that its lineup of NVMe, SAS and SATA SSDs have been successfully tested for compatibility and interoperability with Broadcom's 9400 series of host bus adapters...
Tuesday 21 July 2020
Synaptics announces DisplayLink acquisition
Synaptics has announced a deal to acquire DisplayLink, which provides high-performance video interface technology. This comes on the heels of the acquisition of Broadcom's WiFI and...
Monday 20 July 2020
Taiwan GaAs supply chain to log robust 5G PA shipments in 2H20
Taiwan's GaAs foundry houses Win Semiconductors and Advanced Wireless Semiconductor (AWSC) and epi-wafer supplier Visual Photonics Epitaxy (VPEC) are set to enjoy robust PA (power...
Wednesday 8 July 2020
Synaptics to acquire rights to Broadcom wireless IoT connectivity biz
Synaptics has announced the signing of definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of...