Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Renesas Electronics has announced a decision to delegate IC distribution rights to only a few partners, with Taiwan's WT Microelectronics among them. WT is now also a main sales agent...
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Networking devices, in addition to servers, will be driving the ABF substrate market growth in the second half of 2020 bolstered by growing demand to support remote activities, according...
Pandemic-triggered robust demand for networking chips, notebook chip solutions, healthcare sensors and MCUs is expected to last into October, with networking ASICs, in particular,...
As network connectivity is growingly necceary for users of notebooks and other electronics devices in their remote work and learning activities, a new ecosystem associated with the...
TSMC has an over 50% of the global pure-play foundry market, and the establishment of its new US fab could pose a further threat to Samsung's foundry operations and Globalfoundries,...
Taiwan-based IC design houses have landed a pull-in of orders for 5G base-station and customer-premise equipment (CPE) from China, according to sources at Taiwan's IC distributors.
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
Nan Ya PCB returned to profitability in 2019, thanks to strong shipments of its high-end ABF substrates and an influx of new orders for SiP substrates.
TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle...
GaAs IC foundry Win Semiconductors and Visual Photonics Epitaxy Company (VPEC), which manufactures epitaxial wafers, both saw revenues increase by over 20% in 2019 and are expected...
