ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI (touch and display driver integration)...
Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
Backend house ChipMOS Technologies has signed a five-year syndicated loan for NT$12 billion (US$401.4 million) with 11 local banks in Taiwan, according to a company filing with the...
Backend firm ChipMOS Technologies has announced net profits of NT$22.8 million (US$0.77 million) for the first quarter of 2018, down 86% sequentially and 99% on year, with EPS coming...
ChipMOS Technologies (Shanghai) will target initially the memory chip market and make slow progress in expanding its target markets to include display driver ICs, according to SJ...
ChipMOS Technologies expects to see tight production capacity for COF (chip-on-film) packaging in 2018, and is optimistic about demand for NOR flash and niche-market DRAM memory.
Taiwan-based backend houses are expected to enjoy robust demand for NOR flash memory, which will be driven by a ramp-up of orders for custom ASICs in 2018, according to industry so...
The massive build-ups of OLED panel production capacity by China-based panel makers are expected to bring business opportunities for Taiwan-based makers, including driver IC designers,...
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
While expecting to benefit from increasing demand for IC solutions from the IoT, AI and 5G sectors in 2018, Taiwan-based IC testing and packaging service providers are also expected...
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
With China's LCD panel industry emerging as a major supply source worldwide and demand for panels among China brand vendors of ICT products expanding significantly, Taiwan-based LCD...
The tight supply of NAND flash memory is expected to ease in the first quarter of 2018 as the yield rates at major 3D NAND flash suppliers continue improving, which will significantly...
With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
