With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
ChipMOS Technologies, which provides backend services for mainly memory chips and display driver ICs, expects to post sequential revenue growth starting the second quarter of 2019.
With Nintendo's Switch reportedly to become available in China, Macronix International is expected to see its ROM chip shipments pick up later in 2019, according to industry source...
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...
COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...
The planned launch of foldable smartphones by vendors other than Samsung Electronics such as Huawei and other Chinese brands, will benefit Taiwan's supply chain makers related to...
With more LCD panel suppliers capable of producing in commercial volume OLED displays for smartphones, Taiwan-based driver IC firms and related backend houses are gearing up to grow...
As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...
Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging...
Chip-on-film (COF) packaging demand for panel-use driver ICs, demand for memory chips including niche-market DRAM and automotive NOR flash, and demand for automotive touch and display...
Smartphone vendors intend to promote their all-screen models in 2019 to boost their unit sales amid stagnant global demand for smartphones. With all-screen smartphones adopting TDDI...
Testing house ChipMOS Technologies plans to raise its quotes particularly those for TDDI chips by about 5% in early October, according to industry sources. The price adjustment is...
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Demand for TDDI (touch and display driver integration) chips is set to ramp up starting the third quarter, with Taiwan-based backend firms including Chipbond Technology and ChipMOS...
Japan gaming consoles provider Nintendo is aggressively bracing for the upcoming robust shipments of its star product Switch series gaming machines with the rollout of heavyweight...
