In his 42 months as CEO of Intel, Pat Gelsinger recently issued an internal memo announcing layoffs, sharply criticizing Intel's deep-seated issues. He stated that Intel's "costs...
The third quarter of 2024 has seen a lackluster market for display driver IC (DDI). However, handset DDI demand is expected to be strong thanks to replenishment demand.
SK Hynix has supplied high bandwidth memory (HBM) to Waymo, the autonomous vehicle subsidiary of Google. As the autonomous driving era dawns, HBM is expected to find widespread applications...
Daxin Materials, which provides specialty chemicals for semiconductor, display, and key raw materials, has developed chipmaking materials supporting advanced 2nm manufacturing processes...
Chinese automakers are accelerating the localization of automotive chips to avoid being bottlenecked by chip supply chains and reduce reliance on foreign chips.
China's smartphone application processor (AP) shipments returned to the traditional off-season pattern in the second quarter of 2024, with a slight quarter-on-quarter increase of...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
Intel has been hit with a string of misfortunes of late, as the PC processor giant's brand image is severely tarnished by irrevocable defects in its products, not to mention corporate...
TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Taiwan aims for annual economic growth of 2.8%-3.6% for the next four years, with the government aiming to lift the tech titan's overall output to around $1 trillion over that peri...
