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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 2 October 2024
Intel's fall from grace: a cautionary tale of missed opportunities and missteps
What happens when a tech giant starts to stumble? For outsiders, Intel's decline may come as a shock. However, for industry insiders, the failure of the semiconductor giant can be...
Wednesday 2 October 2024
Arm expresses interest in Intel's product division despite x86 rivalry
Reports suggest that in addition to Qualcomm, Arm has expressed interest in acquiring Intel's product division. However, public speculation indicates that due to the deep-rooted rivalry...
Wednesday 2 October 2024
Enterprise SSD demand boosts NAND process development
The demand for enterprise-level solid-state drives (SSDs) has surged, resulting in price increases as cloud computing service providers (CSPs) actively raise capital expenditures,...
Wednesday 2 October 2024
Synopsys enhances EDA and IP solutions for TSMC advanced technologies with new capabilities
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
Wednesday 2 October 2024
Passive component makers seize AI opportunities and join Nvidia GB200 supply chain
As the fourth quarter approaches, Nvidia's GB200 is emerging as a key focus in the passive components industry. Companies are increasingly targeting the growth potential fueled by...
Wednesday 2 October 2024
Taiwan's IC design houses expect slow 4Q24, hope for 2025 rebound
Taiwan's IC design houses are anticipating a sluggish fourth quarter in 2024 but remain hopeful for a rebound in 2025, driven by increased demand in sectors such as PCs, network communications,...
Wednesday 2 October 2024
Competition for 3nm flagship smartphone SoC imminent; MediaTek gains price advantage in Chinese market
MediaTek's flagship platform, Dimensity 9400, and Qualcomm's Snapdragon 8 Gen4 are set to officially launch in October. With both products making the official transition to the 3nm...
Wednesday 2 October 2024
Taiwanese chip makers' cultural sensitivity put to the test in Japan
Cultural sensitivity has not always been a strength of Taiwanese businesses, potentially straining Taiwan-Japan relations as Taiwan's semiconductor ventures expand overseas without...
Wednesday 2 October 2024
IC design houses seek lower quotes for mature chipmaking processes
IC design firms are aggressively negotiating with foundry partners to achieve lower quotes for mature process manufacturing in order to alleviate cost pressure, according to industry...
Wednesday 2 October 2024
Foxconn confirms investments in India, likely its OSAT venture with HCL
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive...
Wednesday 2 October 2024
Cerebras IPO signals growing challenge to Nvidia's AI chip dominance
As the largest beneficiary of the generative AI surge, Nvidia's dominance has attracted a wave of challengers. The recent initial public offering (IPO) filing by Cerebras signals...
Tuesday 1 October 2024
South Korea's export growth stays strong on chip demand
South Korea's export momentum stayed robust in September on the back of continued demand for semiconductors, keeping the outlook upbeat for economic growth and offering positive signs...
Tuesday 1 October 2024
India-based L&T Semicon anticipates mass production of its first chip within two years
India-based IC design startup L&T Semiconductor Technologies revealed it's developing 15 products, which will be mass-produced in two years and will start the chipmaking business...
Tuesday 1 October 2024
SiPh and glass substrates seen as new areas of focus for TSMC and Nvidia
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
Tuesday 1 October 2024
TSMC talks about key advancements of 3Dblox
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...