Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
JMC Electronics, a supplier of chip-on-film (COF) substrates, reported an 8.2% month-over-month revenue increase in May and anticipates modest sequential revenue growth in the second...
Taiwan-based JMC Electronics, a tape chip-on-film (COF) substrate supplier, saw its net losses narrow to NT$18 million (US$0.58 million) in the first quarter of 2023, despite a 17%...
Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources.
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
