New US trade sanctions against Huawei will bring "uncontrollable variables" to the IC market in the second half of 2020, according to Canon Huang, chairman and president for IC packaging...

Chip-on-film (COF) substrate supplier JMC Electronics has expressed uncertainty about its outlook for the third quarter of 2020 due mainly to fluctuations in demand, according to...

Demand for next-generation fingerprint, touch, display driver integrated (FTDDI) chip solutions is set to boom in 2021 thanks to their growing adoption in mid-range and entry-level...

IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus...

Taiwan-based Chang Wah Electromaterials, a distributor of packaging materials and equipment, has announced plans to invest in COF packaging specialist Chipbond Technology seeking...

Taiwan-based driver IC backend specialists have landed short lead-time orders for business notebooks and tablets that will be used mostly to support remote working and studying needs,...

The supply of 8-inch wafer fabrication services remains tight, due to robust demand for fingerprint-on-display (FoD) solutions, CMOS image sensors and power management ICs, according...

Taiwan-based compound semiconductor components makers are gearing up to fulfill shipments of PA (power amplifier), RF (radio frequency) and VCSEl devices for a new iPhone model, tentatively...

Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...

Chip-on-film (COF) substrate supplier JMC Electronics has seen orders for large-size display driver IC packaging slow down in the fourth quarter of 2019, for which the company is...

With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between second-half 2020 and first-half 2021, Taiwan-based flexible...

Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Taiwan-based backend houses including KYEC and Chipbond expect to see stable growth in demand for baseband chips and LCD driver ICs for Apple iPhone.

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...