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NEWS TAGGED COF
Friday 30 August 2019
Backend firms eyeing COF orders for ultraslim optical fingerprint ID chips
As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...
Thursday 15 August 2019
COF substrate maker JMC sees clear order visibility through 1H20
Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...
Friday 2 August 2019
Chipbond posts profit surge in 1H19
LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...
Wednesday 24 July 2019
TDDI chip prices under downward pressure
Prices of TDDI (touch with display driver integration) chips are under continued downward pressure, as competition in the sector is heating up due to capacity ramps by related IC...
Tuesday 16 July 2019
Taiwan backend houses to see Huawei orders pick up
Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.
Wednesday 10 July 2019
JMC reports record revenues for 2Q19
Chip-on-film (COF) substrate suppliers JMC Electronics saw its revenues for June and the second quarter of 2019 hit record-high levels.
Tuesday 2 July 2019
TDDI IC supply chain turns optimistic about 2H19 on Huawei ban easing
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
Wednesday 26 June 2019
COF substrate firm JMC to enjoy record sales in 2Q19
Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...
Tuesday 25 June 2019
Taiwan flexible PCB firms have limited order visibility
Zhen Ding Technology and Flexium Interconnect, both of which are reportedly among the flexible PCB suppliers of Apple, see low order visibility, according to industry sources.
Thursday 20 June 2019
FPCB makers see mini LED, COF as new niche application segments
Taiwan makers of flexible PCBs are gearing up to develop niche board products for mini LED and COF (chip on film) applications, which are expected to become their new growth drivers...
Monday 17 June 2019
Chipbond to suspend 5G PA packaging capacity expansion
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Wednesday 12 June 2019
JMC expects flat growth or slight decrease in 3Q19 revenues
Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...
Tuesday 4 June 2019
COF packaging demand for smartphones remains promising
Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...
Friday 31 May 2019
COF packaging sees demand emerging for automotive OLED displays
COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...