Chipbond Technology and JMC Electronics, both of whom are among the world's few suppliers of COF substrates, have reported revenue increases for 2018 of 16% and 45%, respectively.
Chip-on-film (COF) packaging demand for panel-use driver ICs, demand for memory chips including niche-market DRAM and automotive NOR flash, and demand for automotive touch and display...
Taiwan-based IC fabrication and packaging material distributors including Topco Scientific, Niching Industrial and Wahlee Industrial are expected to end 2018 with impressive annual...
The chip-on-film (COF) substrate market continues to be dominated by Korea- and Taiwan-based firms, and is considered to be niche with a high barrier of entry for startup companies,...
JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has enjoyed robust orders for Android smartphones...
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...
ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI (touch and display driver integration)...
Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...
Backend house ChipMOS Technologies has signed a five-year syndicated loan for NT$12 billion (US$401.4 million) with 11 local banks in Taiwan, according to a company filing with the...
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
ChipMOS Technologies expects to see tight production capacity for COF (chip-on-film) packaging in 2018, and is optimistic about demand for NOR flash and niche-market DRAM memory.
