IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.

Taiwan-based chip-on-film (COF) substrate makers have seen increased orders from Japan-based driver IC designers, including Renesas Technology and NEC, thanks to the appreciation...

Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...

After seeing its profit decline by eight percentage points sequentially in the second quarter, Chipbond Technology is cautious about its third quarter performance. As utilization...