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NEWS TAGGED COPPER
Tuesday 7 February 2017
Copper foil maker Co-Tech 1Q17 revenues expected to rise
Co-Tech Copper Foil is expected to post sequential revenue growth in the first quarter of 2017, as supply of copper foil is tight, according to industry sources.
Thursday 15 December 2016
Copper foil maker Co-Tech sees revenues up in November
Co-Tech Copper Foil has reported consolidated revenues of NT$520 million (US$16.37 million) for November, increasing 2.56% sequentially and 39.31% on year. Accumulated 2016 revenues...
Monday 25 April 2016
Taiwan university develops aluminum ball bonding technology
While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...
Monday 28 March 2016
Fiber-optic networks unlikely to entirely replace copper wiring in 10 years, says Alpha Networks chairman
While fiber-optic networks are increasingly replacing copper-wired networks, they are unlikely to completely replace copper in 10 years, according to chairman John Lee for networking/communication...
Monday 14 March 2016
Copper foil maker Co-Tech February revenues rise on year
Copper foil maker Co-Tech Copper Foil has reported consolidated revenues of NT$366 million (US$11.2 million) for February 2016, up 14.3% on year. Revenues for the first two months...
Thursday 9 July 2015
FCCL maker AEM reports decreased June revenues
Flexible copper clad-laminate (FCCL) maker Asia Electronic Materials (AEM) has reported revenues of NT$119 million (US$3.8 million) for June 2015, up 4.15% on month but down 26.15%...
Wednesday 24 June 2015
IC backend set for tepid growth in 2H15, says ASE COO
The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...
Thursday 21 May 2015
Applied announces breakthrough technology for patterning copper interconnects at 10nm and beyond
Applied Materials has announced its Applied Endura Cirrus HTX PVD (physical vapor deposition) system with breakthrough technology for patterning copper interconnects at 10nm and beyond...
Friday 28 November 2014
Co-Tech looking to diversify products
Co-Tech Copper Foil has developed copper oxide powders for use in HDI manufacturing, with volume shipments slated for the second quarter of 2015, according to the copper foil maker...
Monday 18 August 2014
Co-Tech to see improved sales of copper foils in 3Q14
Co-Tech Copper Foil expects its sales to improve in the third quarter of 2014 due a rebound of copper foils from the notebook sector, according to the company.
Thursday 3 July 2014
Copper foil prices to remain low amid oversupply
Copper foil suppliers are unlikely to hike their quotes for the time being due to oversupply in the market despite stabilizing copper prices, according to industry sources.
Thursday 27 March 2014
Copper foil maker Co-Tech shifting focus to copper oxide, thin copper foil
Co-Tech Copper Foil will shift its focus to produce new products, including copper oxide and thin copper foil for lithium batteries, to shore up its profitability, according to company...
Wednesday 5 March 2014
Co-Tech to step into production of copper oxide
Copper foil manufacturer Co-Tech will start producing copper oxide in the second quarter of 2014, with a monthly capacity of 200-300 tons, according to the company.
Wednesday 12 February 2014
SPIL to grow sales of silver wire-bonding packaging in 2014
Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.
Thursday 12 December 2013
Copper foil prices to continue dropping in 1Q14
Quotes for copper foil are likely to continue to drop in the first quarter of 2014 due to oversupply caused by capacity ramps by China-based suppliers, according to industry source...