Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.

While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...

TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...