Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
With Nvidia's recently announced Blackwell GPU architecture poised to become the mainstream for the next generation of AI servers, industry watchers expect Blackwell-equipped AI servers...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
