Nvidia has announced the launch of a new class of large-memory AI supercomputer, the Nvidia DGX, powered by Nvidia's GH200 Grace Hopper superchips and the Nvidia NVLink Switch System,...

Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...

Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.

At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.

TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.

Microsoft has reportedly approached TSMC and its ecosystem partners about using the foundry's CoWoS packaging for its own AI chip, according to industry sources.

A surge in high-end AI chip demand spurred by the growing popularity of ChatGPT is expected to drive demand for TSMC's CoWoS packaging, according to industry sources.

Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...

AMD will utilize TSMC's CoWoS packaging for the next generation of its datacenter accelerators, according to industry sources.

TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...

TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...

MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...

Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...

TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...

Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform...