In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
The explosive growth in Generative AI (GenAI) business opportunities spurred by ChatGPT drives the demand for hardware and software related to the GenAI supply chain. TSMC, the sole...
PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said...
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
With Nvidia's recently announced Blackwell GPU architecture poised to become the mainstream for the next generation of AI servers, industry watchers expect Blackwell-equipped AI servers...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
