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Friday 5 July 2024
Samsung pivots to AI chip development amid major semiconductor division reorganization and talent acquisition drive
Samsung Electronics is reportedly shifting its focus from automotive chip development to AI chips amid plans for significant business reorganization. This strategic pivot comes as...
Thursday 4 July 2024
South Korea strives to boost EDA competitiveness
Lee Jong-ho, Korea's Minister of Science and ICT, reportedly arranged a meeting with semiconductor Electronic Design Automation (EDA) professionals to gain insights into the local...
Thursday 4 July 2024
Arm's grand AI blueprint: standardizing chip designs with global partnership
Arm, the world's largest semiconductor IP company, is reportedly drafting a new blueprint for the AI era.
Thursday 4 July 2024
India-based MosChip leads design of indigenous HPC chip for national computing initiative
India-based IC design house and IP provider MosChip Technologies secured a deal to design a homegrown HPC chip made by TSMC, amid India's indigenization efforts in the AI era.
Wednesday 3 July 2024
SMC Diode to quadruple production with new fab in China
SMC Diode Solutions has recently celebrated the inauguration of its second power discrete fab in Nanjing, China.
Wednesday 3 July 2024
TSMC optimistic about massive AI demand in Japan; introduces 3nm process to automotive chips
At the TSMC 2024 Japan Technology Symposium held on June 28, besides discussing the previously announced A16 chip technology, TSMC also revealed that it achieved revenue growth in...
Tuesday 2 July 2024
GF acquires GaN technology from Tagore
GlobalFoundries has acquired Tagore Technology's proprietary and production-proven power gallium nitride (GaN) IP portfolio to push the boundaries of efficiency and performance in...
Monday 1 July 2024
Taisol sees increasing trend in use of liquid cooling
Liquid cooling is widely used in newly built data centers, and L2L (liquid to liquid) architecture has been widely adopted, according to Taiwan-based cooling module maker Taisol El...
Monday 1 July 2024
Faraday joins Intel Foundry accelerator design services alliance
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, has announced its participation in the Intel Foundry Accelerator Design Services.
Monday 1 July 2024
Intel pins hopes on x86S to challenge Arm ascendancy
In the evolving PC industry, Intel's dominance is challenged by Arm, reshaping market dynamics, and leaving Intel vulnerable on many fronts. Its new x86S architecture, a purely 64-bit...
Friday 28 June 2024
Sam Altman-backed Rain AI hires Apple chip vet to lead hardware
Rain AI has recruited an Apple Inc. chip executive to lead hardware engineering, the second high-profile hire this month for a startup trying to design a new type of semiconductor...
Thursday 27 June 2024
Infineon to support consumer sustainability goals through product carbon footprint data transparency
Chip manufacturing is the primary source of the carbon footprint generated by electronic devices. To address this, German chip giant Infineon plans to calculate the carbon footprint...
Wednesday 26 June 2024
Synopsys expected to provide automation and analytics tools for Tata Electronics chipmaking facilities in India
Following the collaboration with Taiwan-based PSMC to build a 300mm wafer fab in India, Tata Electronics plans to expedite the operation of the fab with tools provided by Synopsys.
Wednesday 26 June 2024
ASE sees better prospects in 2H24, thanks to robust advanced packaging demand
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...