The third quarter of 2024 has seen a steady increase in the demand for industrial memory, thanks to rising DRAM contract prices and end-market inventory correction coming to an end,...
DRAM chipmaker Nanya Technology and Winbond Electronics, a maker of specialty DRAM and flash memory, both saw their July revenue decrease by 18.4% and nearly 4%, respectively, compared...
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
AP Memory Technology, which specializes in customized IoT RAM and other DRAM memory, saw its revenue and gross margin rebound in the second quarter of 2024, thanks to increased demand...
Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to...
SK Hynix is set to showcase its latest advancements in its memory technologies and products at the upcoming Future Memory and Storage (FMS) 2024 event.
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Memory prices are expected to remain stable or go up in the third quarter of 2024 for different market segments, but consumer demand will continue to be disappointing, according to...
With the memory shortage expected to resolve in the second half of 2024, price hikes for memory are also anticipated to abate, according to CEO Chang Chia-Kun of Apacer Technology,...
Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
