Formula One, commonly known as Formula 1 or F1, has expanded its partnership with Lenovo Group due to their shared ideas regarding artificial intelligence (AI) applications, according...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Advanced Micro-Fabrication Equipment Inc. China (AMEC), a China-based semiconductor equipment supplier, announced the resignation of Senior Vice President Tuqiang Ni and Core Technical...
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
The escalating tensions between major powers are reshaping global investment and trade patterns, leading to a surge in companies facing divestment, relocation, and investment shifts...
Japan is the industry leader in materials and equipment, while Taiwan maintains an overwhelming advantage in semiconductor manufacturing, according to Takashi Hattori, deputy representative...
China's latest domestically produced DUV exposure machine cannot perform the critical multiple exposures needed for advanced chip production, making it incapable of achieving finer...
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
China recently achieved a milestone with its indigenous lithography system, which is capable of producing chips at nodes smaller than 65nm. However, the development of an immersive...
At SEMICON India 2024, major Japanese semiconductor suppliers participated, with Tokyo Electron set to expand its presence in India, underscoring the strategy to tap into the growing...
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
The adoption of Wi-Fi 7 across the iPhone 16 series is expected to be a key driver for the rapid penetration of the wireless technology, with Android flagship smartphones likely to...
India's approval of one wafer fab and four integrated circuit (IC) backend projects has prompted semiconductor equipment providers from the US and Japan to expand their operations...
One of the critical focal points in the US-China tech war is the collaborative effort by the US, Japan, and the Netherlands to prevent Chinese semiconductor companies from acquiring...
