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Wednesday 31 July 2024
ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
Tuesday 30 July 2024
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Tuesday 30 July 2024
LG Innotek to enter GCS market, following Samsung and SK
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
Monday 29 July 2024
TSMC to start using high-NA EUV tools for A14P in 2028
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Monday 29 July 2024
Weekly news roundup: Huawei sues MediaTek in China; YMTC head expects explosive chip demand in China
These are the most-read DIGITIMES Asia stories in the week of July 22 – July 26.
Monday 29 July 2024
Japan bets on back-end processes to resurrect chip industry, attracting investments from TSMC, Samsung, and Intel
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
Friday 26 July 2024
Chinese semiconductor equipment could reach advanced levels in 5-10 years, says AMEC CEO
Although China is still a long way from meeting international standards in the field of semiconductor equipment, it is entirely feasible for the country to achieve technologically...
Thursday 25 July 2024
Taiwan's NCKU achieves angstrom-scale breakthrough in semiconductor precision
The semiconductor industry, traditionally operating at the nanometer scale, is now pushing the boundary toward the even tinier "angstrom" scale (one-tenth of a nanometer) with an...
Thursday 25 July 2024
KLA sees bright future in advanced packaging and HBM, expects flat growth in China
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
Thursday 25 July 2024
Optical industry acquiring new factories in fear of land shortage
Players in the optical industry have been expanding factories abroad or purchasing new ones in Taiwan as demand for optical components has continued to rise from many different applications,...
Thursday 25 July 2024
TSMC to break ground for German fab at year-end 2024, sources say
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Wednesday 24 July 2024
BOE's B16 OLED commitment boosts South Korean suppliers, Wonik to receive increased orders
Chinese panel manufacturer BOE has recently announced the construction of its 8.6G IT OLED production line, known as B16. This development has significantly benefited numerous South...
Wednesday 24 July 2024
Taiwan machinery sector gains from global supply chain reshuffle amid US-China tensions
Observers believe that US President Joe Biden's decision to forgo his re-election bid will undoubtedly boost Donald Trump's chances of returning to the White House. This could likely...
Wednesday 24 July 2024
SDC 8.6G OLED investment fuels South Korea panel equipment import surge
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research