At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...
China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...
MediaTek has launched its newest chips in the smartphone gaming-focused G series - the MediaTek Helio G25 and G35. The latest chips feature MediaTek HyperEngine game technology for...
Globalfoundries has announced its most advanced FinFET solution, 12LP+, which is ready for production. The differentiated 12LP+ solution is optimized for artificial intelligence (AI)...
TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...
TSMC is expected to kick off volume production of chips manufactured on an enhanced version of its 5nm FinFET process, dubbed tentatively 5nm Plus, in the fourth quarter of 2020,...
TSMC has an over 50% of the global pure-play foundry market, and the establishment of its new US fab could pose a further threat to Samsung's foundry operations and Globalfoundries,...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has revised upward its capex outlook this year to US$4.3 billion, up US$1.1 billion or about 34% from...
Semiconductor Manufacturing International (SMIC), China's top IC foundry, has disclosed plans to trade its shares on the science and technology innovation board (STAR) of China's...
Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...
TSMC has disclosed that its 3nm technology development remains on track, with risk production scheduled for 2021 followed by volume production in the second half of 2022.
China's Semiconductor Manufacturing International (SMIC) with its 14nm FinFET process manufacturing has obtained orders from HiSilicon, according to industry sources.
Semiconductor Manufacturing International (SMIC) has moved 14nm FinFET process to volume production with orders from Huawei's chip arm HiSilicon, and is gearing up for its next-generation...
