Thintech Materials, a subsidiary of China Steel Corporation, is ramping up its semiconductor operations with expected significant growth by 2025, driven by target and evaporation...
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Innolux Corporation reported 2024 consolidated revenue of NT$216.5 billion (US$6.58 billion), marking a 2.3% increase from the previous year, underscoring the company's strategic...
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
Taiwanese panel maker Innolux has established its Intelligent Automation Solutions (IAS) Business Center, which focuses on three major product lines targeting smart manufacturing...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend...
Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, as shifting demand and complex verification processes...
Innolux has seen delays in mass production for FOPLP and no progress in its new LCD panel fab project in India, but company chairman Jim Hung stressed that the firm will not be deterred...
Advanced material provider Wah Hong is developing packaging and materials for Micro LED and Mini LED technologies with prices ranging from US$200 to US$300 per square meter. Company...
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
