As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...

SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.

Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...

As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.

TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...

The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.

At the close of 2023, Innolux shuttered its 5.5-generation LCD panel facility. Reports suggest that potential buyers for this plant include Micron and TSMC. Recently, TSMC has reportedly...

Innolux has selected FOPLP as the primary driver of its transformation from an LCD panel maker to a semiconductor firm and is getting ready for market growth, according to company...

FOPLP has emerged as the primary force in Innolux's transformation and has also gained significant attention since TSMC disclosed its intention to develop it. However, FOPLP is still...

ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...

Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account...

Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.

Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...

The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...