Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.

Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...

Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.

The supply chain for Nvidia's AI processors continues to evolve and expand, despite recent negative market sentiment, according to industry sources.

Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum,...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting...

A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...

SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...

Taiwan's Favite, a leading supplier of automated optical inspection (AOI) equipment for LCD, OLED, and mini/microLED displays, has begun shipping microOLED AOI equipment to the Chinese...

Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...

As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...

SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.

Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...

As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.