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NEWS TAGGED HBM
Monday 26 August 2024
Weekly news roundup: Intel's 18A under fire for yield; US Chips Act scale now bigger than China Big Fund II
These are the most-read DIGITIMES Asia stories in the week of August 19 – August 23.
Thursday 22 August 2024
SK Hynix's 1H24 revenue soars in US and China, driven by AI demand
SK Hynix, which recorded its best performance ever in the first half of 2024, has experienced remarkable growth in the US and Chinese markets. The company managed to revitalize several...
Thursday 22 August 2024
Samsung lands short lead-time HBM orders from China CSPs
China-based cloud service providers (CSP) have placed short lead-time orders for HBM memory with Samsung Electronics, purposely stockpiling HBM chip inventory ahead of time due to...
Tuesday 20 August 2024
Global semiconductor manufacturing industry strengthens in 2Q24, SEMI reports
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure,...
Tuesday 20 August 2024
Chipmakers hike DDR5 prices
In response to robust demand for servers that has resulted in capacity constraints, major DRAM manufacturers have significantly increased the prices of DDR5 memory in the third quarter,...
Friday 16 August 2024
SK Hynix expands HBM supply to automotive applications beyond servers
SK Hynix has supplied high bandwidth memory (HBM) to Waymo, the autonomous vehicle subsidiary of Google. As the autonomous driving era dawns, HBM is expected to find widespread applications...
Tuesday 13 August 2024
SK Hynix to face challenges for US fab despite subsidies
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Tuesday 13 August 2024
SK CEO expects HBM4 launch ahead of schedule
Tae-won Chey, CEO and chairman of SK, was quoted in recent South Korean media reports as addressing the market's growing fears about the AI bubble and the commercialization of sixth-generation...
Monday 12 August 2024
Weekly news roundup: Intel telecommunications faces cost cuts; Indian opto-semiconductor maker makes acquisition
These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.
Friday 9 August 2024
Samsung denies HBM3E testing success amid industry projections of quadrupled revenue by late 2024
Samsung Electronics has clarified to DIGITIMES that testing of its 5G high-bandwidth memory (HBM3E) is still ongoing, despite recent reports suggesting successful completion...
Thursday 8 August 2024
Advanced packaging market sees rapid growth fueled by AI and global expansion
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
Thursday 8 August 2024
SEMI Japan urges unified advanced chips packaging standards to ease capacity crunch
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
Thursday 8 August 2024
China rushing into chiplet and HBM fab tool development
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Wednesday 7 August 2024
CXMT's initial HBM capacity in Hefei reaches one-third of Korean manufacturers
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
Tuesday 6 August 2024
SK Hynix secures US$450 million in US CHIPS Act funding for HBM memory fab
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...