In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs...
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Samsung Electronics announced at its shareholders' meeting that it is investing in the development of an AI accelerator, MACH-1, aiming to challenge Nvidia, and further revolutionize...
Samsung Electronics significantly expanded its DRAM market share in the fourth quarter of 2023, extending its lead over SK Hynix to 14 percentage points from a quarter earlier. While...
