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NEWS TAGGED HBM
Friday 12 July 2024
SK Hynix ramps up talent recruitment to strengthen HBM4 competitiveness
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Rising HBM demand to benefit SK Hynix supplier in China
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net...
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Friday 5 July 2024
SK Hynix converts part of M10 production lines to produce HBM products
SK Hynix is reportedly converting part of its production line at its Icheon semiconductor plant in South Korea to manufacture high bandwidth memory (HBM) in response to rapidly increasing...
Friday 5 July 2024
Samsung expected to achieve 14-fold surge in operating income amid memory business recovery
Samsung Electronics is poised to report impressive results for the second quarter of 2024, driven by a recovery in the semiconductor industry. The company's operating profit surpassed...
Wednesday 3 July 2024
China tech firms adopt 'multi-chip hybrid' strategy to enhance AI capabilities amid US curbs, diversifying beyond Huawei
Chinese tech companies are embracing a 'multi-chip hybrid' strategy to enhance their ultimate AI computing power. This approach supplements foreign offerings while avoiding sole reliance...
Tuesday 2 July 2024
Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Tuesday 2 July 2024
Huawei is developing HBM with Wuhan XMC: media
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
Monday 1 July 2024
SK Hynix aims to lead HBM Market for AI Chips, invests $75 Billion by 2028
Following a two-day annual strategy meeting, SK Hynix has announced plans to invest a hefty KRW$103 trillion (USD$74.6 billion) in its chip business for the next 3 years. SK Group,...
Monday 1 July 2024
HBM creates winners in the semiconductor ecosystem in 2Q24
Despite ongoing inventory challenges, global semiconductor providers have seen substantial increases in market valuations over the past quarter.
Friday 28 June 2024
China's HBM demands account for 7% of 2024 global total
High Bandwidth Memory (HBM) is becoming the core of the High-Performance Computing (HPC) arms race.
Thursday 27 June 2024
China sees bumpy road ahead for homegrown HBM development, lagging memory giants by 10 years
China's development of homegrown High Bandwidth Memory (HBM) has a long way to go, lagging behind international memory giants by 10 years.
Thursday 27 June 2024
AI drives Micron turnaround to profit with future price hikes expected
Micron announced substantial growth in its latest financial results.
Wednesday 26 June 2024
Micron poised to bet on high-efficiency HBM, more DRAM for AI phones
The 2024 memory market has been heavily focused on High Bandwidth Memory (HBM) for cloud AI servers.