Samsung Electronics recently disclosed its next-generation memory solution technology roadmap on Memory Con 2024.

Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...

Micron Technology has seen its orders for High Bandwidth Memory (HBM) wait to be fulfilled throughout 2025.

Reports suggest that Samsung Electronics may soon become the sole supplier of 12-layer HBM products for Nvidia.

Support from Taiwan's supply chain was behind US memory IDM Micron's successful mass production of its latest-generation high bandwidth memory (HBM) product – HBM3E –...

The South Korean memory industry is finally starting to recover.

Huang showcased his diplomatic flair at Nvida's AI developers' conference.

SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company...

Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...

Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK...

Players in the memory industry are fiercely competing with each other in developing the fifth-generation High Bandwidth Memory (HBM) HBM3E due to the intense demand from AI GPUs....

Against the backdrop of the emergence of protectionism, competition surrounding High Bandwidth Memory (HBM) is also heating up. Although the South Korean court has ruled to hinder...

Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...