Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...

SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...

Samsung is engaged in fierce HBM competition with Micron.

Micron Technology has begun volume production of its HBM3E memory. Nvidia H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024, will include Micron's...