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    As Huawei Ascend courts the Middle East and Southeast Asia, Washington raises red flags
    2min ago
    NEWS TAGGED HBM4
    Wednesday 16 July 2025
    Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
    Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
    Monday 14 July 2025
    Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

    As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

    Wednesday 9 July 2025
    Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?
    Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
    Friday 4 July 2025
    Intel's new AI accelerator may adopt HBM4? SK Hynix stresses no confirmed details
    Intel recently held its AI Summit in South Korea, sharing the latest trends in artificial intelligence (AI) technology and innovative applications across various industries. The event...
    Thursday 3 July 2025
    Samsung completes development of 1c DRAM, paving way for HBM4 rollout

    Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product...

    Thursday 3 July 2025
    Micron tightens grip on AI memory market as Samsung certification lags
    Micron Technology is stepping up its game in the competitive high-bandwidth memory (HBM) market, leveraging recent wins to boost production and capture rising demand driven by artificial...
    Wednesday 2 July 2025
    Towa expands South Korea presence as AI spurs demand for HBM packaging tools
    Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...
    Wednesday 2 July 2025
    Samsung pitches 12-stack HBM3E to Nvidia after AMD's AI accelerator win
    Samsung Electronics is intensifying its push to secure a major HBM3E supply deal with Nvidia, as Device Solutions chief Jun Young-hyun visited Nvidia's Silicon Valley headquarters...
    Friday 27 June 2025
    SK Hynix debuts 16-layer HBM4, set to power AI chips in 2026
    At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...
    Thursday 26 June 2025
    Micron ships HBM4 samples to customers, anticipates DDR4 shortage after EOL notice
    Micron is doubling down on HBM as a core growth driver, reporting strong momentum in its HBM3E ramp and laying out a clear roadmap for its next-generation HBM4 products.
    Monday 23 June 2025
    SK Hynix reportedly clinches custom AI memory orders from Nvidia, Microsoft, Broadcom
    SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ahead of domestic rival Samsung Electronics in the race...
    Monday 23 June 2025
    Samsung targets HBM comeback as DRAM leadership slips to rival
    Samsung Electronics wrapped up its global strategy meeting with the Device Solutions division, outlining plans to regain ground in high-bandwidth memory and foundry operations. The...
    Friday 20 June 2025
    SK Hynix widens lead over Samsung as HBM race accelerates
    South Korea's top chipmakers, SK Hynix and Samsung Electronics, are heading into 2025 with dramatically diverging fortunes, as the global race for AI-driven memory dominance accelerates...
    Thursday 19 June 2025
    Nvidia Rubin accelerates SK Hynix's lead in HBM4 supply race
    As Nvidia prepares to begin supplying samples of its next-generation AI accelerator "Rubin," industry sources report that SK Hynix is accelerating shipments of sixth-generation high-bandwidth...
    Friday 13 June 2025
    AMD confirms Samsung, Micron memory in MI350 chips in bid to break Nvidia's grip on AI
    AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...
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    Research Report Database
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    Jul 9, 10:42
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    Wednesday 9 July 2025
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    Monday 30 June 2025
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    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES