SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
Tae-won Chey, CEO and chairman of SK, was quoted in recent South Korean media reports as addressing the market's growing fears about the AI bubble and the commercialization of sixth-generation...
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.
SK Hynix and TSMC are collaborating on the development of the next generation of high bandwidth memory (HBM). Although it is widely believed that SK Hynix would entrust TSMC with...
Samsung Electronics and SK Hynix recently disclosed the orders and development of their High-Bandwidth Memory (HBM) products and have released optimistic comments for standard DRAM...
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness...
