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Monday 26 October 2020
Taiwan makers urged to build high-end IC substrate ecosystem
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Monday 5 October 2020
5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are expected to begin...
Wednesday 9 September 2020
OSAT providers to enjoy impressive SiP sales growth in 2020
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Wednesday 9 September 2020
Suppliers gearing up for SiP demand boom
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
Friday 4 September 2020
SiP demand to boom in 2021
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Friday 21 August 2020
TSMC to talk about sub-3nm process, SoIC at upcoming tech forums
TSMC at its upcoming technology symposiums will disclose more details about the foundry's 3nm and 2nm process nodes, and advanced 3D heterogeneous integration technology, such as...
Monday 13 July 2020
Chinese chipmakers keen on developing 5G RF, PA modules
Chinese chipmakers including Lansus Technologies, MeidaTek-affiliate Vanchip Technology, and Unisoc Communications under the Tsinghua Unigroup are keenly developing 5G RF-FEM products...
Friday 10 July 2020
ASE Technology sees record 1H20 revenues, stronger 3Q20
Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...
Friday 3 July 2020
E&R sees wafer-level laser cutting equipment orders surge
Taiwan-based E&R Engineering has enjoyed a surge in wafer-level laser cutting equipment orders from major chipmakers recently and also begun investing in R&D of equipment...
Thursday 18 June 2020
Intel, TSMC gearing up for heterogeneous 3D IC integration
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Tuesday 26 May 2020
IC analysis labs see slowdown in 2H20 demand from Huawei, US chipmakers
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
Tuesday 26 May 2020
ASMPT well positioned to ride the next wave of Advanced Packaging in Heterogeneous Integration
ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...
Monday 25 May 2020
ASE poised to apply SESUB-based SiP tech to new TWS devices
Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...