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TSMC to talk about sub-3nm process, SoIC at upcoming tech forums

Monica Chen, Taipei; Jessie Shen, DIGITIMES Asia Friday 21 August 2020 0

TSMC at its upcoming technology symposiums will disclose more details about the foundry's 3nm and 2nm process nodes, and advanced 3D heterogeneous integration technology, such as SoIC (system-on-integrated chips) packaging.

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