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TSMC packaging development to remain focused on SoIC, organic interposer in 2021

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 24 August 2020 0

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated WSE (wafer-scale engine) AI chips for Cerebras with InFo-SoW packaging...

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