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Intel, TSMC gearing up for heterogeneous 3D IC integration

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Thursday 18 June 2020 0

Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated chips) technology for 3D heterogeneous integration in 2021.

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