TSMC expects to post revenues of between US$12.4 billion and US$12.7 billion in the fourth quarter of 2020, which is a 3.4% sequential increase at the midpoint. Gross margin and operating...
Taiwan-based IC test solutions providers including Chunghwa Precision Test Tech (CHPT), Keystone Microtech and WinWay Technology have enjoyed a pull-in of short lead-time orders for...
Global server shipments are expected to see a CAGR of 6.7% from 2020-2025, driven by demand for datacenter, HPC, AI and 5G related applications, according to Digitimes Research's...
Taiwan-based IC test interface specialist Chunghwa Precision Test Technology (CHPT) is stepping up AI-based smart production of vertical probe cards (VPC) seeking to compete well...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
PCB equipment supplier Symtek Automation Asia (SAA) expects higher sales in second-half 2020 than in first-half 2020, with even brighter market prospect for 2021.
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Macnica Galaxy, a Taiwan-based IC distribution arm of Japan's Macnica Group, has reported its first-half 2020 net profits soared 87.6% on year to a four-year high of NT$130 million...
