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Monday 18 May 2020
TSMC US fab plan may boost server production in North America
TSMC is mostly likely to turn out 5nm HPC chips for datacenter server applications at its planned 5nm fab in the US, and whether the move will push up server contract production in...
Monday 18 May 2020
TSMC may move mature CoWoS tech to US fab, say sources
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
Wednesday 13 May 2020
Nan Ya PCB swings to profit in 1Q20
Nan Ya PCB returned to profitability in the first quarter of 2020, driven by strong shipments of its high-end ABF substrates.
Tuesday 12 May 2020
Burn-in test demand for Wi-Fi, HPC chips surges
IC testing solution providers have recently enjoyed a ramp-up in orders for burn-in board orders for use in the manufacture of 802.11ax (Wi-Fi 6) and high-performance computing (HPC)...
Tuesday 12 May 2020
Power Logic expects shipments for graphics cards to pick up in 2H20
Cooling fan maker Power Logic expects the upcoming rollouts of 7nm GPUs by AMD and Nvidia to drive its shipments for high-end graphics cards in the second half of 2020.
Tuesday 12 May 2020
Unimicron embraces brisk orders for ABF substrates
Unimicron Technology has seen clear order visibility for ABF substrates at least through the third quarter, with the orders mainly for 5G infrastructure, networking and HPC chips...
Monday 11 May 2020
Zhen Ding, Unimicron looking to extend lead over peers via bold capex injection
The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...
Monday 4 May 2020
IC test interface vendors enjoy strong demand from AMD, Nvidia
Taiwan's IC test interfaces vendors are enjoying a significant ramp-up in orders for high-end, customized test solutions from AMD and Nividia as the chipmakers are poised to roll...
Thursday 30 April 2020
Samsung to spend big on EUV fab tools in 2020
Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...
Wednesday 29 April 2020
TSMC lands additional InFO packaging orders from Nephos
TSMC has landed additional InFO (integrated fan-out) packaging orders requiring short lead times from MediaTek's Nephos, according to industry sources.
Monday 27 April 2020
IC test interfaces vendors to gain from HPC GPU demand boom
Nvidia and AMD are stepping up promotion of high performance computing (HPC) GPU chips solutions built on advanced nodes for server, AI and 5G applications and HiSilicon is also reportedly...
Friday 24 April 2020
CHPT sees VPC orders ramp up for HPC, ASIC applications
Chunghwa Precision Test Tech (CHPT) has seen strong demand in the short term for its vertical probe cards (VPCs) for processing handset APs, RF, HPC and ASIC solutions increasingly...
Thursday 23 April 2020
IC inspection demand surges on strong R&D at top chipmakers
Despite the coronavirus pandemic's impacts on the global supply chains, TSMC, first-tier chipmakers and leading backend firms have still sustained strong R&D momentum while pursuing...
Wednesday 22 April 2020
Delayed lifting tool delivery reportedly to affect TSMC advanced process capacity installation
TSMC has seen the installation of its advanced 3nm and 5nm process capacity disrupted by lifting equipment delivery delays, according to sources familiar with the matter.
Tuesday 21 April 2020
Taiwan PCB makers eyeing 5G infrastructure, HPC applications for 2020 growth
Taiwan-based PCB makers are expected to see robust demand for 5G base stations, servers, networking equipment and HPC devices significantly drive up their shipments in 2020 while...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research