China-based cloud service providers and server vendors are keenly developing ASIC chips solutions on their own, particularly those for 5G base stations and servers, providing new...
As part of their efforts to bolster economic development amid the ongoing coronavirus pandemic, many countries are stepping up establishment of 5G base stations and large-size datacenters,...
High-end high performance computing (HPC) chips solutions are entailing ever-rising packaging complexity along with their increasing applications to large-size datacenters and networking...
Backend and verification demand for ASICs, AI chips and HPC (high performance computing) chips from segments of 5G base stations, servers and datacenters has remained strong despite...
IC backend houses are enjoying stronger demand from 5G infrastructure, server and datacenter segments than the handset sector that is being increasingly hit by the fast spread of...
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second...
Combined revenues of Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are expected to drop 1.2% sequentially...
Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...
Ansys has increased its R&D workforce in Taiwan by 50% to support its local chipmaking partners, according to Roger Lee, company country manager for Taiwan.
Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...
Chunghwa Precision Test Tech (CHPT) saw sales generated from its new VPC (vertical probe card) product line grow to account for a double-digit percentage of the company's total revenues...
Foxconn Electronics has offered a high-performance computing (HPC) facility for use by National Taiwan University (NTU) Cancer Center, according to Yong Lin Health Care Foundation...
Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...
Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...
