ASE Technology has entered the backend supply chain of Huawei/HiSilicon's ARM-based Kunpeng 920 server CPU, with its affiliated Siliconware Precision Industries (SPIL) set to start...
Taiwan Semiconductor Manufacturing Company (TSMC) expects significant sales from the the high performance computing (HPC) sector in 2020, an indication that chip vendors are still...
Members in the TSMC Grand Alliance have been fully assured that their revenue and profit growth momentum will not slow down in the months ahead, bolstered by the foundry's better-than-expected...
TSMC has disclosed that its 3nm technology development remains on track, with risk production scheduled for 2021 followed by volume production in the second half of 2022.
Despite rising shipments for servers, notebooks and game consoles recently due to increasing stay-at-home needs, sources from brand vendors expect the momentum for consumer-related...
Taiwan-based IC design houses remain optimistic about demand for server peripheral chips, which will be further strengthened in the second half of 2020, according to industry sourc...
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
Taiwan-based IC substrates makers including Unimicron and Na Ya PCB are expected to see their capacities, especially those for ABF substrates, fully booked till fourth-quarter 2020,...
Demand for high-end IC manufacturing materials remains robust with clear order visibility stretching into the third quarter of 2020, bolstered by growing adoption of advanced fabrication...
Unimicron Technology has seen clear order visibility for high-end IC substrates, especially ABF substrates for processing diverse HPC and networking chips, stretching to the third...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
With the advent of the 5G era, global DRAM bit-based consumption is expected to approximately double by 2023, and wafer-level memory burn-in test services will become increasingly...
Taiwanese PCB makers, despite the coronavirus pandemic's impacts, still expect 5G handset demand to pick up later this year, and remain reluctant to move production out of China in...
