United Microelectronics Corporation (UMC), a leading semiconductor foundry, announced today that UMC was named "Best Silicon Foundry (CMOS)" by Infineon Technologies, recognizing...
Semiconductor manufacturers worldwide are expected to see their combined 200mm fab capacity increase 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches...
Some consumer IC designers are concerned about possible competition from IDMs in Europe and the US, who they fear could be forced to join the supply of consumer chips to boost the...
Germany is seeking to become a leading hub of semiconductor manufacturing. With its world-class automobile industry now going through digitalization and electrification, the country...
Chinese car vendors have asked chip suppliers, including foreign ones, to place wafer starts for their demand with China-based foundries as China accelerates its push for IC self-sufficiency,...
The European Chips Act proposed by the European Commission in February 2022 has yet to be adopted, but criticisms toward the act from within Europe's semiconductor industry have never...
As part of its efforts to ease serious domestic talent shortage, the government in Taiwan has recently reactivated its overseas recruitment campaign, which was earlier interrupted...
Chinese chipmakers are keen on developing homegrown automotive power semiconductors, particularly IGBT chips and modules long in shortage, looking to replace part of foreign supplies...
Taiwan-based OSATs including ASE Technology, Powertech Technology Group (PTI), King Yuan Electronics (KYEC), Ardentec, Sigurd Microelectronics are all looking to grow revenues from...
TSMC and UMC will see full capacity utilization for 22/28nm processes persist at least throughout 2022, as their capacities vacated by some consumer chip clients are soon filled by...
China-based OSAT Tongfu Microelectronics, who now commands 80% of AMD's outsourced backend orders, has said its business results will see only limited impact from order cuts amid...
Delivery lead times for automotive-qualified IGBTs have been prolonged to 50 weeks or more, with the component shortage showing no sign of easing, according to industry sources in...
Japan's Sumitomo Metal Mining (SMM) has decided to construct a new 8-inch direct bonded SiC wafer substrate mass-production prototype line, which will be completed for March 2024...
IDMs have been promoting their integrated GaN chip solutions, and may step up outsourcing the production of such devices to satisfy growing demand, according to industry sources.
