Eyeing promising demand for AIoT device applications, IDMs and IC design houses are entering long-term cooperation to grow related ecosystems highlighting AI-based edge computing...
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
With IDMs such as Infineon and STMicroelectronics experiencing prolonged delivery lead times for industrial MCUs, Taiwan-based MCU suppliers are looking to fill the growing supply...
Infineon Technologies has disclosed it is expanding its existing backend operations in Indonesia, with PT Infineon Technologies Batam to purchase real estate from PT Unisem, a member...
Delivery lead times for automotive and industrial MCUs from international IDMs are still long reaching at least 30 weeks or even more than one year, while Taiwan makers are gearing...
Hangzhou Fullsemi Semiconductor, an IDM foundry specializing in analog chips, has raised an undisclosed sum of investment from China's National Semiconductor Industry Investment Fund...
STMicroelectronics Asia Pacific has notified its distributors about price increases for all its product lines in the second quarter of 2022, which may encourage other automotive and...
The supply of power management ICs, particularly those demanding 8-inch wafer fab capacities, will remain constrained over the next several years, despite international IDMs keenly...
After surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of US$190.4 billion, according to IC Insights.
Automotive MCU prices are expected to rise by another 15-20% in the second quarter of 2022 due to supply-side constraints, according to sources at related IC distributors.
Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex...
Infineon Technologies has announced that it is investing more than EUR2 billion (US$2.27 billion) to build a third module at its site in Kulim, Malaysia, aiming to consolidate its...
International integrated device manufacturers (IDMs) are taking the lead to migrate from 8-inch wafer fabs to 12-inch fabs for the production of high-margin automotive metal oxide...
Infineon Technologies has disclosed it will launch power semiconductors with CoolSiC MOSFET and .XT technology in the XHP 2 package - tailored specifically to the requirements of...
