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NEWS TAGGED ORIENT SEMICONDUCTOR ELECTRONICS
Tuesday 24 October 2023
Taiwan OSATs see partial fab utilization recovery
Several Taiwan-based OSATs, including ChipMOS Technologies, Lingsen Precision Industries, Orient Semiconductor Electronics (OSE), and Walton Advanced Engineering, have begun to see...
Friday 4 August 2023
Memory backend houses see influx of short lead-time orders
Memory backend specialists including Powertech Technology (PTI), ChipMOS Technologies and Orient Semiconductor Electronics (OSE) have received an influx of short lead-time orders...
Tuesday 25 July 2023
OSE sees EMS business bolstered by robust AI server demand
As inventory adjustments at semiconductor and electronics supply chains may persist into the fourth quarter of the year, many medium-sized OSATs are seeking different niches to bolster...
Friday 7 October 2022
Memory chips to see demand recover faster than logic ICs
Memory makers such as Micron Technology and Kioxia are expected to see their business operations undermined by sharp declines in end-market demand for consumer electronics devices...
Tuesday 27 September 2022
ASEH to see production utilization drop in 4Q22
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Tuesday 26 October 2021
Holtek says no plan to raise prices for MCUs
Holtek Semiconductor has no plans to raise its MCU and other consumer IC prices despite foundry costs continuing to rise, as Chinese peers are striving to win more orders for small...
Tuesday 5 October 2021
Wire-bonding demand for consumer chips may slow down in 2022
Demand for wire-bonding packaging is likely to slow down in 2022 as backend houses have decided to defer installation of new wire-bonders that have reached them following long delivery...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Thursday 22 July 2021
Backend houses see lead times prolonged notably
Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous...
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