A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
The burgeoning AI industry is accelerating the arrival of the silicon photonics (SiPh) era, and Taiwan's industry is actively promoting various integration efforts to seize the growing...
The Canada-Taiwan Semiconductor Co-Innovation Forum, held on September 6 in Hsinchu during the week of SEMICON Taiwan 2024, attracted Taiwanese semiconductor supply chain companies...
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound se...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
Samsung Electronics unveiled its next-generation process blueprint at the Samsung Foundry Forum 2024 (SFF 2024), but the response from the semiconductor industry has been somewhat...
GlobalFoundries (GF) is optimistic that silicon photonics (SiPh) will become a key growth area for the future data center market. In a recent interview with All About Circuits, Vikas...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
