The advancement of generative AI hinges on enhancing the scale and refinement of current AI models, according to recent statements from numerous AI industry leaders. These improvements...
Hubei Jiufengshan Laboratory, with CNY8.2 billion (approx. US$1.12 billion) subsidy from the Chinese government, has integrated a laser light source into a silicon chip, marking a...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
AMD has teamed up with Taiwan-based BE Epitaxy Semiconductor Technology and Best Epitaxy Manufacturing for joint development of next-generation silicon photonics (SiPh) technology,...
With the recent surge in AI, silicon photonics, and co-packaged optics (CPO), combined with TSMC's advancements in cutting-edge processes, Taiwan's materials analysis leader MSScorps...
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
The UK continues to further its automotive and other industries while investing heavily in high-tech sectors. Harnessing its extensive academic expertise, the country is making significant...
The burgeoning AI industry is accelerating the arrival of the silicon photonics (SiPh) era, and Taiwan's industry is actively promoting various integration efforts to seize the growing...
The Canada-Taiwan Semiconductor Co-Innovation Forum, held on September 6 in Hsinchu during the week of SEMICON Taiwan 2024, attracted Taiwanese semiconductor supply chain companies...
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound se...
