MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
ASE Technology is partnering with TSMC on the development of silicon photonics (SiPh), and has cut into the supply chain of Tier-1 chip vendors for co-packaged optics (CPO) products,...
Regional politics will become a new variable to the development of the semiconductor industry in the next decade, and semiconductor players should manage to learn its unpredictability...
TSMC is involved in an R&D project led by Nvidia to use its silicon photonic (SiPh) integration technology called COUPE (compact universal photonic engine) for graphics hardware...
AMD has made quarterly share gains in the serve market consecutively for three years, according to Mercury Research. It made its largest quarterly gain in second-quarter...
