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Thursday 21 January 2021
MediaTek launches 6nm 5G SoC chips
MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology.
Wednesday 20 January 2021
CHPT, WinWay land major test interface orders for 5G handset SoCs
Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and WinWay Technology have both obtained major orders for MediaTek's new-generation 5G SoC chips slated...
Friday 15 January 2021
WinWay breaks ground for new plant in southern Taiwan
WinWay Technology, a dedicated supplier of IC test interface solutions, has recently broken ground for a new plant in Kaohsiung, southern Taiwan.
Thursday 14 January 2021
MediaTek enhances ASIC and IP design capability
MediaTek continues to enhance its ASIC and IP design capability through several acquisitions announced recently, while recruiting talent from the IP and IC design industry sectors,...
Monday 4 January 2021
M31 Technology developing IP for TSMC 3nm process
Silicon IP provider M31 Technology is engaged in the development for TSMC's upcoming 4nm and 3nm process technologies, and will introduce related IPs for mobile SoC designs in 2021,...
Wednesday 30 December 2020
Airoha to acquire IC Plus
Airoha Technology, a MediaTek subsidiary, will acquire all shares of fellow company IC Plus at NT$22 (US$0.78) per share, according to company filings with the Taiwan Stock Exchange...
Wednesday 23 December 2020
Realme launches MediaTek-powered 5G phones in Taiwan
Realme has launched two new 5G-enabled smartphones in the Taiwan market, as the Chinese handset vendor seeks to further ramp up its share in the local market. Both models will be...
Wednesday 23 December 2020
Taiwan IC ecosystem unscathed by Huawei ban
The impact of Huawei's woes on its Taiwan-based chip suppliers has been smaller than expected, according to industry sources.
Friday 18 December 2020
MediaTek announces equity investment in Asix
MediaTek through subsidiary Airoha Technology will invest up to NT$495 million (US$17.6 million) through private placement to acquire an about 20% stake in fellow Taiwan-based IC...
Thursday 17 December 2020
Unimicron may resume fire-disrupted shipments of FCCSP substrates in 1Q21
Unimicron Technology expects to resume shipments of BT-based FCCSP substrates for processing handset SoCs in first-quarter 2021 at the earliest, with the shipments to be delivered...
Wednesday 16 December 2020
High performance and low power consumption give Winbond's 1Gb LPDDR3 DRAM the edge in Tsing Micro's new AI image-processing SoC
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved...
Friday 4 December 2020
ProteanTecs to host live webinar on SoC quality and time-to-revenue
ProteanTecs, a global leader of Deep Data solutions for electronics' health and performance monitoring, announced today an upcoming live webinar titled "Increasing SoC Quality and...
Thursday 3 December 2020
ASE obtains FC packaging orders for new Qualcomm 5G SoC
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Friday 20 November 2020
Concerns rising over tight BT substrate supply for handset SoCs
Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...
Thursday 19 November 2020
MediaTek optimistic about 2021
MediaTek is confident its complete mobile SoC lineup will buoy its performance in 2021, according to company chairman Rick Tsai.